There is speculation about the processor that Samsung may use in its upcoming flagship Galaxy S25 series next year. Initially, reports suggested that the Galaxy S25 series could feature the Exynos 2500 processor in certain regions, which experts predicted would outperform the Snapdragon 8 Gen 4 processor. However, a recent report from South Korean publication TheElec indicates that Samsung might introduce a new heatsink technology to address overheating concerns in future Exynos chipsets.
Samsung is reportedly working on a new chip-packaging technology known as fan-out wafer-level package-HPB (FOWLP-HPB), which involves optimizing a heatsink called a heat path block (HPB) to enhance heat dissipation on top of the processor. This technology, commonly used in PCs and servers, is anticipated to be incorporated into future Exynos processors due to their smaller form factor in smartphones. Samsung’s Advanced Package (AVP) business, within its chip division, is leading the technology’s development and aims to finalize it by Q4 2024 followed by mass production. If this timeline holds, the Exynos 2500 chipset rumored to power the Galaxy S25 series may feature this new heatsink technology.
Regarding processor choices for the Galaxy S25 series, while there were earlier reports suggesting Samsung might opt for a MediaTek processor and abandon the Exynos due to yield issues, industry analyst Ming-Chi Kuo hinted that Qualcomm could be the exclusive chip supplier for this series. Additionally, there are speculations that Samsung might eliminate the Plus models from its Galaxy S flagship lineup to simplify the range and may even opt for utilizing a combination of three chips in certain models.
