Samsung Electronics, the world’s largest maker of memory chips, has announced a new head for its semiconductor business in an effort to lead the AI chip race. Young Hyun Jun will take over as the head of the semiconductor division, while Kyehyun Kyung will now lead the future business division and the Samsung Advanced Institute of Technology. The company aims to increase its competitiveness in light of the uncertain global business environment.
Samsung is currently in fierce competition with SK Hynix to produce the most advanced memory chips in order to capitalize on the AI trend. The memory chip market is currently dominated by Samsung, SK Hynix, and Micron, the top three suppliers globally. SK Hynix is leading in high-bandwidth memory, supplying HBM3 chips to Nvidia, a major player in AI chips. Nvidia is reportedly considering Samsung as a potential supplier.
There is expected to be increased competition in high-bandwidth memory in 2025, with SK Hynix planning to start mass production of its 12-layer HBM3E chips in the third quarter. Samsung Electronics also aims to begin production in the second quarter, closing the technology gap between the two companies. As a result, all three major suppliers are anticipated to supply HBM3E chips to Nvidia, leading to intensified price competition in the market.
To remain competitive in this fast-paced industry, Samsung Electronics has taken several steps. Firstly, it has appointed Young Hyun Jun as head of its semiconductor business unit. This move reflects Samsung’s commitment to staying at the forefront of innovation and leadership within this critical sector.
Secondly, Kyehyun Kyung has been appointed as head of Samsung’s Future Business Division and Samsung Advanced Institute of Technology (SAIT). In this role, he will focus on developing cutting-edge technologies that can help propel Samsung into an even more dominant position within this rapidly changing landscape.
Finally, Samsung Electronics recognizes that there are significant challenges ahead as it seeks to maintain its position as a leader within this highly competitive field. To address these challenges head-on
