The evolution of semiconductor packaging has been significant, moving from 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level. This advancement has allowed for single micronmeter level interconnecting pitches and over 1000 GB/s bandwidth. Key parameters in semiconductor packaging include Power, Performance, Area, and Cost. Power efficiency is improved through innovative packaging techniques, while Performance benefits from shortened interconnection pitches. Area requirements vary depending on the type of chip and the smaller z-form factor of 3D integration. Cost reduction strategies involve exploring alternative materials and enhancing manufacturing efficiency.
Semiconductor packaging technologies have come a long way with various options for interposers in both 2.5D and 3D packaging. These include Si-based, organic-based, and glass-based interposers. In 3D packaging, microbump technology is continuously evolving to achieve smaller pitches, with the current single-digit micronmeter pitch being achieved through the innovative hybrid bonding method, which utilizes a groundbreaking Cu-Cu connection.
Industry professionals can gain valuable insights into these advanced semiconductor packaging technologies by attending this webinar. Topics covered will include discussions on the latest advancements in packaging technology and their impact on Power, Performance, Area, and Cost parameters. Attendees can also expect to learn about the various interposer options available and the evolution of microbump technology in achieving smaller pitches.
In conclusion, semiconductor packaging has come a long way with numerous innovations that have improved power efficiency, performance benefits, area requirements and cost reduction strategies. With this webinar attendees can gain valuable insights into these advanced technologies that are used in modern electronics industry.
