Amkor Technology to Showcase Semiconductor Packaging and Test Services at Goldman Sachs Global Semiconductor Conference

Amkor Technology, Inc., a renowned provider of semiconductor packaging and test services, has announced that it will be participating in the Goldman Sachs Global Semiconductor Conference on May 29, 2024. The presentation will take place at 12:50 pm Eastern Time (9:50 am Pacific Time) at the Goldman Sachs Conference Center in New York, NY.

Those unable to attend in person can access a live webcast of the presentation on the Investor Relations section of Amkor’s website at ir.amkor.com. Management will also be available for one-on-one and small group meetings with investors during the conference.

Founded in 1968, Amkor Technology, Inc., is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test) service provider. They have been at the forefront of IC packaging and test services outsourcing and are a manufacturing partner for leading semiconductor companies, foundries, and electronics OEMs. With production facilities, research and development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the United States, Amkor is well-positioned to serve a global market. For more information about their turnkey manufacturing services for a range of industries including communication, automotive, industrial, computing, and consumer electronics visit their website at amkor.com

For any investor relations inquiries please contact Jennifer Jue Vice President of Investor Relations and Finance at 480-786-7594 or jennifer.jue@amkor.com Stay updated on social media by following @amkortechnology